Xiaomi is rumored to have purchased 232-layer 3D NAND flash memory for the latest smartphones

At the 2022 Flash Memory Summit (FMS), YMTC officially released the fourth-generation 3D TLC NAND flash memory chip based on the Xtacking 3.0 architecture, named X3-9070. With higher storage density, faster I/O speeds, and the X3-9070 is the first 200+ layer 3D NAND flash solution to enter the retail market compared to the previous generation. At present, the X3-9070 is mainly used for domestic sales of storage products, but it may soon appear in terminal equipment sold worldwide.

Xiaomi held a flagship new product launch event last month to officially release the Xiaomi 14 series of smartphones. According to Business Korea, Xiaomi has purchased 232-layer 3D NAND flash memory chips from YMTC for use in its latest smartphones. At present, smartphones mainly use 176-layer NAND flash memory chips, and Xiaomi's new product may have the strongest storage subsystem in the world's smartphones.

Xiaomi launched its first desktop PC last year, that is, Xiaomi mini host, which uses the PC300 series SSD built by YMTC for OEMs, but uses the third-generation NAND flash memory chip based on the crystal stack 2.0 architecture. Since YMTC has entered Xiaomi's supply chain, it is not surprising that the two sides will further expand the scope of cooperation.

At present, YMTC has at least two 232-layer 3D NAND flash memory chips, in addition to the X3-9070, a 1Tb 3D TLC NAND flash memory chip, and the 1Tb 3D QLC NAND flash memory chip used in the new consumer SSD product Zhizhi TiPro600, both of which are based on the Crystal Stack 3.0 architecture, with an I/O transfer rate of 2400 MT/s.